AI-native product engineering

Deep engineering
at AI speed

hypersolv takes on the hardest parts of hardware development — fluid dynamics, heat transfer, structures, embedded systems — and delivers them in days, not quarters. AI runs the iteration. Domain experts and real labs verify every result.

FIELD VELOCITY · LOW → HIGH

SEC 01 / ENGAGEMENT

From one problem to the whole product

Engagements scale to the problem — not the other way around.

SCOPE / SINGLE ANALYSIS

Solve a problem

A single hard analysis, handed off and returned solved. Flow separation, a hot spot that won't die, a structure failing margin — scoped in days, answered with validated results.

SCOPE / COMPONENT

Build a subsystem

A heat exchanger, a cooling loop, a control unit — designed, simulated, prototyped, and handed over with the data to prove it works.

SCOPE / END-TO-END

Build the product

Full product development: requirements to validated, manufacturable hardware, with systems engineering holding every discipline together.

SEC 02 / CAPABILITIES

The physics-heavy disciplines, in-house

CFD

Fluid dynamics & CFD

External and internal flows, multiphase systems, hydrodynamics — resolved with AI-accelerated solvers and checked against experiment.

HTX

Heat transfer & heat exchangers

Thermal management from chip to system: exchanger design, cooling loops, waste-heat recovery.

FEA

Structural analysis

Static, fatigue, and dynamic FEA; composite structures; designs that clear margin without carrying dead weight.

SYS

Systems engineering

Requirements, interfaces, trade studies, integration — the discipline that keeps multi-domain programs coherent.

EMB

Firmware & embedded

Control systems, instrumentation, and edge compute that ship with the hardware they run on.

DFM

Design for manufacturing

Designs that survive contact with the factory: tolerances, materials, processes, and cost engineered in from the start.

SEC 03 / PROCESS

AI moves fast. Experts make it real.

01

Scope

We define the problem with you — geometry, operating conditions, constraints, success criteria. Days, not discovery phases.

02

Iterate

AI-accelerated simulation runs the design loop: hundreds of CFD, thermal, and structural variants explored in the time a traditional firm sets up one model.

03

Verify

Domain experts review every candidate design. Physical validation in partner labs confirms the physics before you commit to building. Nothing ships on simulation alone.

Every result carries two signatures: the model's and an expert's.

SEC 04 / VERIFICATION NETWORK

A verification network, not just a model

Domain experts

Professors and senior engineers across thermal, fluids, structures, and controls review designs in their own domain — before anything reaches you.

Lab environments

Flow rigs, thermal test benches, materials testing — lab facilities in the IIT Madras ecosystem put hardware through real conditions, not just meshes.

Proven in pilots

Active pilots with deep-tech ventures in the IIT Madras ecosystem — real programs, real hardware, real deadlines.

Energy & climateAerospace & defenseData centers & coolingIndustrial & manufacturingMarine & hydro systems

SEC 05 / TEAM

Built by people who build hardware

CO-FOUNDER

Prof. Satyanarayanan Seshadri

Faculty, Applied Mechanics, IIT Madras. Leads the Energy & Emissions Research Group (EnERG). Formerly GE Global Research and Forbes Marshall — two decades in thermal and energy systems, from waste-heat recovery to industrial decarbonization.

CO-FOUNDER

Harish Rajesh

IIT Madras. Built IITM's first electric race car with Formula Student. Structures, composites, aero- and hydrodynamics — most recently engineering ground-effect aircraft at Waterfly Technologies.

SEC 06 / CONTACT

Put a problem on the table

Tell us what you're building — or what's stuck. We reply within two working days with how we'd approach it, and how fast.

hello@hypersolv.tech